A method of packaging electronic components without creating unnecessary solder balls

摘要

An electronic component having electrodes is packaged on a printed circuit board on which lands are formed in a pattern of arrangement that corresponds to the electrodes by soldering the electrodes to the lands. Solder paste is printed on the lands in a shape such that the edges of the solder paste lie inside the edges of the lands. The electrodes are then placed on the solder paste, and the solder paste is caused to reflow to solder the electrodes to the lands.