首页> 外国专利> Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device

Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device

机译:薄膜半导体器件的制造方法,薄膜半导体器件本身,液晶显示器和电子器件

摘要

In order to fabricate a high performance thin film semiconductor device using a low temperature process in which it is possible to use low price glass substrates, a thin film semiconductor device has been fabricated by forming a silicon film at less than 450°C, and, after crystallization, keeping the maximum processing temperature at or below 350°C.;In applying the present invention to the fabrication of an active matrix liquid crystal display, it is possible to both easily and reliably fabricate a large, high-quality liquid crystal display. Additionally, in applying the present invention to the fabrication of other electronic circuits as well, it is possible to both easily and reliably fabricate high-quality electronic circuits.
机译:为了使用可以使用廉价玻璃基板的低温工艺来制造高性能薄膜半导体器件,已经通过在低于450℃的温度下形成硅膜来制造薄膜半导体器件,并且,在结晶之后,将最高处理温度保持在或低于350℃。在将本发明应用于有源矩阵液晶显示器的制造中,可以容易且可靠地制造大型,高质量的液晶显示器。 。另外,在将本发明也应用于其他电子电路的制造中,可以容易且可靠地制造高质量的电子电路。

著录项

  • 公开/公告号EP1335419A3

    专利类型

  • 公开/公告日2003-08-27

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号EP20030008849

  • 发明设计人 MIYASAKA MITSUTOSHI SEIKO EPSON COR.;

    申请日1995-06-15

  • 分类号H01L21/205;H01L29/49;H01L21/336;H01L29/786;G02F1/136;

  • 国家 EP

  • 入库时间 2022-08-21 23:49:11

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