- - 3 - Chip-Level Three-Dimensional Multi-Chip Package Having Chip Selection Pad Formed On Chip-Level And Making Method Therefor

摘要

The invention chip - provides a chip package and a method of manufacturing the same-level three-dimensional multi. Multi according to the invention automatically through the pad for N-1 of the chip select formed on level chip packages N of semiconductor integrated circuit elements are directly laminated and configuration, each integrated circuit chip select terminal formed on the devices are chip It is separated. For the chip select pads through the metal wiring and the through hole formed in the insulating layer is connected to the upper connection terminal, it is connected to the lower connection terminal via the wiring trench penetrating through the internal chip. In particular, a chip select because for the pads are connected to the upper connection terminal at the top of the pad for the chip select neighboring, each integrated circuit when the element is bonded to achieve the lamination, each of the chip select terminal are automatically separated in the stacking bottom circuit is connected to the lower connection terminals of the device.