Bonding tool capable of bonding inner leads of TAB tapes to electrode pads in high quality and high productivity and bonding method

摘要

PURPOSE: To provide the inexpensive bonding method of the inner leads of TAB which is superior in productivity and bonding quality. CONSTITUTION: The base 3a of a bonding tool 3 is made to abut on a plurality of inner leads 2a projected in parallel from a TAB tape, and it is pressed onto a plurality of electrode pads 1a arranged on an IC chip 1 so as to bond them. The base 3a of the bonding tool 3 has a uniform flat shape for an area longer than the forming intervals of the electrode pads 1a when viewed in the arranging direction of the electrode pads 1a, and the length of the pressed areas have shapes shorter than the length of the electrode pads 1a when viewed in the projecting direction of the inner leads 2a.