Confirmed apparatus of wafer's edge in Chemical-mechanical polishing

摘要

PURPOSE: An apparatus for confirming wafer's edge in chemical mechanical polishing is provided to be capable of easily detecting wafer state including the wafer damage according to the result of the CMP process by using a rotating part. CONSTITUTION: An apparatus for confirming wafer's edge(10) is provided with a cassette(20) having a plurality of slot(S) for storing wafers(W), a lever(32) capable of moving up and down the wafer(W) by the pressure of a worker, a rotating part(34) attached to the lever(32) for rotating the wafer(W), and a housing(30) connected through the inner portion of the cassette(20) for being capable of moving up and down and rotating the wafer(W). The rotating part(34) further includes a driving shaft, a rotating shaft geared to the driving shaft, a belt for rotating the wafer(W), and a plurality of rollers for moving the belt and preventing the sag of the belt.