PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE ELEMENT COMPRISING THE SAME PROCESS FOR PRODUCING RESIST PATTERN AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD

摘要

(A) binder polymer, (B) an ethylenically unsaturated bond to having at least one photopolymerizable compound and (C) a photosensitive resin composition contain a photopolymerization initiator, wherein the component (A) as a binder polymer of two or more binders in a molecule be made of a polymer and / or will have a polydispersity of from 2.5 to 6.0, said component (B) as the photopolymerizable compound is a photosensitive resin having at least one for each of ethylene glycol chain and an alkylene glycol chain of 3 to 6 carbon atoms in the molecule composition.