首页>
外国专利>
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, PROCESS FOR PRODUCING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, PROCESS FOR PRODUCING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD
展开▼
机译:光敏树脂组合物,包含相同成分的光敏元件,制造抗蚀剂图案的过程以及印刷电路板的制造过程
展开▼
页面导航
摘要
著录项
相似文献
摘要
(A) binder polymer, (B) an ethylenically unsaturated bond to having at least one photopolymerizable compound and (C) a photosensitive resin composition contain a photopolymerization initiator, wherein the component (A) as a binder polymer of two or more binders in a molecule be made of a polymer and / or will have a polydispersity of from 2.5 to 6.0, said component (B) as the photopolymerizable compound is a photosensitive resin having at least one for each of ethylene glycol chain and an alkylene glycol chain of 3 to 6 carbon atoms in the molecule composition.
展开▼