CONDUCTOR TRACK ARRANGEMENT AND METHOD FOR PRODUCING A CONDUCTOR TRACK ARRANGEMENT

摘要

An interconnect arrangement ( 100 ) has a first layer ( 101 ), a first layer surface ( 102 ), thereon at least two interconnects ( 104 ) having a second layer surface ( 105 ) essentially parallel to the first layer surface ( 102 ), thereon a respective second layer ( 106 ) for each interconnect ( 104 ), the second layers ( 106 ) of adjacent interconnects covering regions between the adjacent interconnects ( 104 ), and thereon a third layer ( 107 ), which completely closes off the regions between the adjacent interconnects ( 104 ) by means of coverage.