A CHEMICAL-MECHANICAL POLISHING MACHINE FOR POLISHING A WAFER OF MATERIAL, AND AN ABRASIVE DELIVERY DEVICE FITTED TO SUCH A MACHINE

摘要

The polishing machine has a polishing plane (1) driving a rotation movement. There is a polishing head (4) with a non rotating part (40,41) and a polishing slab. There is an abrasive distribution mechanism abrasive source. A fixing (420) provides attachment to the non rotating part. The abrasive is fed (51) into the ring and there are distribution holes.