Device for packaging electronic components by injection molding used for e.g. chip size packaging comprises electronic components arranged on a first side of a system support in a predetermined position

摘要

Device for packaging electronic components by injection molding comprises electronic components (2) arranged on a first side (6) of a system support (4) in a predetermined position. Device for packaging electronic components by injection molding comprises electronic components (2) arranged on a first side (6) of a system support (4) in a predetermined position. The system support has conducting pathways, contact surfaces for connecting to the contact surfaces of the electronic components and through-contacts for applying external contact surfaces and/or contact humps to a second side (8) lying opposite the first side. The system support is a ceramic substrate covered on the first side by a plastic layer. An Independent claim is also included for a process for packaging electronic components by injection molding.