Electronic package module for optoelectronic component, has circuit board comprising bearing area on which electronic parts are mounted, and molding material arranged at area and partially covering one of parts and not covering other part

摘要

The module (100) has a printed circuit board (110) comprising a bearing area (110a) on which two electronic parts (121a, 121b, 122a, 122b) are mounted. A molding material (130a, 130b) is arranged at the area and partially covers one of the electronic parts and not covers the other electronic part. A conductive shielding layer covers the molding material, and the printed circuit board is provided with a ground pad (112g) that is located on the area, and the conductive shielding layer is connected with the pad. Side surfaces (134a, 136a) are connected between an upper surface and the area. The printed circuit board is designed as a double-sided printed circuit board. An independent claim is also included for a method for manufacturing an electronic package module.