Electronic component i.e. surface-mounted device, manufacturing method, involves partially covering electronic module by plastic compound, and arranging antenna element on plastic compound over another antenna element

摘要

The method involves partially covering an electronic module (2) by a plastic compound (4). An antenna element (11) is arranged on the plastic compound over another antenna element (10) using a tampon printing process and is partially covered by the plastic compound. A dielectric carrier (15) is arranged on the electronic module via the latter antenna element and is partially covered by the plastic compound. The antenna elements are separated from each other by the dielectric carrier, where the former antenna element is arranged on the dielectric carrier. An independent claim is also included for an electronic component comprising an integrated circuit with a high frequency transmitting- and receiving device.