Process for re-melting solder material applied on connecting sites used in the semiconductor industry comprises re-melting the solder material using an RTP method

摘要

Process for re-melting solder material applied on connecting sites comprises re-melting the solder material using an rapid thermal processing (RTP) method. Preferred Features: The solder material is heated to an objective temperature and re-melted at this temperature for a maximum of 120 seconds, preferably for a maximum of 60 seconds. The objective temperature is 100-500, preferably 180-350 deg C. The solder material contains at least two metals forming a material system. The solder material is made from gold tin (AuSn).