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Mask for manufacture of semiconductor device has imaging region and second region with second exposure mask obtained by replication of part of exposure mask in imaging region

机译:用于制造半导体器件的掩模具有成像区域和第二区域,第二区域具有通过复制成像区域中的一部分曝光掩模而获得的第二曝光掩模

摘要

The mask (10) has an imaging region (12), with an exposure mask for exposure of the surface of the semiconductor device and a second region (11) with a second exposure mask provided by replication of at least part of the first exposure mask, e.g. by replication of a test structure incorporated within the first exposure mask. An Independent claim for a manufacturing method for a mask used for manufacture of a semiconductor device is also included.
机译:掩模(10)具有成像区域(12),该成像区域具有用于曝光半导体器件的表面的曝光掩模,并且具有第二区域(11),第二区域(11)具有通过复制第一曝光掩模的至少一部分而提供的第二曝光掩模。 ,例如通过复制结合在第一曝光掩模内的测试结构。还包括用于制造半导体器件的掩模的制造方法的独立权利要求。

著录项

  • 公开/公告号DE10127540C1

    专利类型

  • 公开/公告日2003-01-02

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2001127540

  • 发明设计人 SCHWEEGER GIORGIO;

    申请日2001-05-31

  • 分类号G03F1/00;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:54

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