Micro lithographic projection exposure method for manufacturing e.g. LCD, involves projecting mask structure on region of layer using projection exposure apparatus, where regions are arranged in parts in optical path of illumination device

摘要

The method involves providing a substrate i.e. silicon wafer, including a layer made of light sensitive material i.e. photo-resist. A micro lithographic projection exposure apparatus including an illumination device (101) and a projection lens (102) is provided, where the illumination device has a polarization manipulator (115) with a pair of regions that influence a polarization state of splitting light in different ways. A mask structure is projected on a region of the layer using the exposure apparatus, where the regions are arranged in parts in an optical path of the illumination device. An independent claim is also included for a micro lithographic projection exposure apparatus.