Electric component or chip handling apparatus e.g. for chip bonding, has e.g. conveyor belt with self-adhesive surface for moving components to working station for processing

摘要

The apparatus includes a conveying part (6) which extends between a receiving station (5) where the components are transferred by a pick-up head to the conveying part, and a working station (7) where the components are processed. The conveying part has a conveying surface that is formed so that the components releasably adhere to it. The surface may be self-adhesive. The conveying part may be a conveyor belt formed form a film. The belt may be single-use.