首页> 外国专利> Electrical component e.g. surface acoustic wave filter, for use in portable apparatus, has intermediate film for overstretching lower chip, and upper chip arranged on film above lower chip, where chips are provided with electrical terminals

Electrical component e.g. surface acoustic wave filter, for use in portable apparatus, has intermediate film for overstretching lower chip, and upper chip arranged on film above lower chip, where chips are provided with electrical terminals

机译:电气元件用于便携式设备的表面声波滤波器具有用于使下芯片过度拉伸的中间膜,以及布置在下芯片上方的膜上的上芯片,其中芯片设有电端子。

摘要

The component (EB) has a lower housing portion (UG) with a concave portion (KA), and a lower chip (UC) and an upper chip (OC) with electrical terminals (EA1, EA2), where the lower chip is arranged in the concave portion. The terminals are internally interconnected to the lower chip and the upper chip. An intermediate film (ZF) partially overstretches the lower chip, and the upper chip is arranged on the film above the lower chip. The housing portion is made of ceramic e.g. high temperature co fired ceramic (HTCC) and low temperature co fired ceramic (LTCC), and polymer. An independent claim is also included for a method for manufacturing an electrical component.
机译:部件(EB)具有带有凹入部分(KA)的下部外壳部分(UG),下部芯片(UC)和带有电端子(EA1,EA2)的上部芯片(OC),其中下部芯片被布置在凹部。端子在内部互连到下部芯片和上部芯片。中间膜(ZF)部分地过度拉伸下部芯片,并且上部芯片布置在下部芯片上方的膜上。壳体部分由陶瓷制成,例如陶瓷。高温共烧陶瓷(HTCC)和低温共烧陶瓷(LTCC),以及聚合物。还包括用于制造电气部件的方法的独立权利要求。

著录项

  • 公开/公告号DE102010007605A1

    专利类型

  • 公开/公告日2011-08-11

    原文格式PDF

  • 申请/专利权人 EPCOS AG;

    申请/专利号DE20101007605

  • 发明设计人 LEIDL ANTON DR.;PAHL WOLFGANG;

    申请日2010-02-11

  • 分类号H01L25/04;H01L23/50;H01L21/60;B81B7/00;B81C3/00;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:24

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