Method for positioning and fixing e.g. semiconductor chip, on e.g. direct copper Bonding substrate, involves pressing components together such that electrical connection and mechanical fixing of components are obtained

摘要

The method involves fitting semiconductor chip (3) to a suitable position on another component i.e. direct copper bonding substrate (1) by a placing device (5) over an electrically conducting intermediate layer (2). The placing device is activated relatively to another component such that a prefixing is obtained by the intermediate layer and one of the components. The intermediate layer is heated on a temperature that is increased opposite to room temperature. The components are pressed together such that an electrical connection and a mechanical fixing of the components are obtained. The placing device is equipped with a pressing element made of ceramic material or porous sintered metal material. An independent claim is also included for an arrangement for positioning and fixing electrical and electronic component on another component.