Method for aligned application of silicon chips with switching structures on e.g. wafer substrate, involves fixing aligned components on substrate by electrostatic force by applying electrical holding voltage above metallization surfaces

摘要

The method involves providing a carrier substrate with metallization surfaces i.e. pads, having hydrophilic or lipophilic characteristics, where areas surrounding the surfaces are hydrophobic or lipophobic. Components are applied on fluid assembling medium i.e. conductive adhesive, provided at the surfaces. The components are held at a surface of the medium based on surface tension of the medium to align the components above the surfaces. The aligned components are fixed on the substrate by electrostatic force by applying electrical holding voltage above the surfaces of the substrate. An independent claim is also included for a method for manufacturing a carrier substrate with metallization surfaces.