A composition for the chemically - mechanical polishing of metal - and metal / dielectrics structures

摘要

A composition containing 2,5 to 70 vol. -% of a 30 w -% cationically modified silica sol, the cationically modified sio φ 2 φ - particles having a mean particle size of from 12 to 300 nm, and 0,5 to 22% by weight - at least one oxidizing agent, with a ph - value of 2,5 to 6 is outstandingly suitable as a polishing slurry for the chemically - mechanical polishing of metal - and metal / dielectric materials - structures.