Production of a hybrid photodetector array on a read circuit involves hybridization of a first substrate containing photodetectors and a second substrate containing a read circuit

摘要

Production of a hybrid photodetector array on a read circuit involves: forming photodetectors on a thin semiconducting layer (13); forming the read circuit on a second substrate (20); hybridization of the first and second substrates; and removal of the remaining part (11) of the first substrate (10) and obtaining a hybrid photodetector array on a read circuit. Production of a hybrid photodetector array on a read circuit involves: (a) forming photodetectors on a thin semiconducting layer (13) used for forming a photodetector array, the semiconducting layer (13), preferably made of silicon, being separated from the remaining part (11) of the first substrate (10) by a barrier layer (12) made of SiO2 (preferred), Si3N4 or diamond and preferably comprising at least two sub-layers, for thinning down the first substrate (10), and the photodetectors having bonding pads (18) for connection to the read circuit; (b) forming the read circuit comprising CMOS transistors, bipolar transistors or Bi-CMOS transistors on a second substrate having bonding pads for connection to the photodetectors; (c) hybridization of the first (10) and second substrates by electrical connections (30) comprising fusible metallic balls between the bonding pads of the substrates; and (d) removal of the remaining part (11) of the first substrate (10) by polishing and/or etching and obtaining a hybrid photodetector array on a read circuit after removing the remaining part (11) of the first substrate (10). After producing the hybrid photodetector array on a read circuit, at least one other layer is applied on the photodetector array in order to implement optical treatment of the surface. The other layer can be an antireflection layer or an optical filter layer. The area of the thin semiconducting layer in contact with barrier layer is preferably doped in order to form a common electrode for the photodetector array. Localized electrical connections are formed with the doped area across the barrier layer. The space between the electrical connections, separating the photodetector array from the read circuit, is filled with an electrically insulating material.