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HEAT-DISSIPATING EPOXY RESIN COMPOSITION AND INSULATED ELECTRIC AND ELECTRONIC COMPONENT
HEAT-DISSIPATING EPOXY RESIN COMPOSITION AND INSULATED ELECTRIC AND ELECTRONIC COMPONENT
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机译：散热环氧树脂组合物和绝缘的电子电气组件
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摘要
PROBLEM TO BE SOLVED: To provide a low viscosity heat-dissipating epoxy resin composition that has a high filling factor of Al2O3 (alumina) and a spherical minute filler in the composition and an excellent processability and heat-dissipating property and is suitable for heat-insulation and the like by mixing the alumina and the spherical minute filler and a method for manufacturing a heat-insulated electric and electronic component using the heat-dissipating epoxy resin composition.;SOLUTION: The heat-dissipating epoxy resin composition contains (a) an epoxy resin, (b) an acid anhydride, (c) Al2O3 (alumina), (d) a spherical minute filler and (e) a silane compound as a wetting dispersing agent.;COPYRIGHT: (C)2004,JPO
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机译：解决的问题：提供一种具有高填充因子Al 2 O 3 （氧化铝）和球形微小填料的低粘度散热环氧树脂组合物。该组合物具有优异的加工性和散热性，并且通过将氧化铝和球形微小填料混合而适合于隔热等，以及使用该散热性环氧树脂制造隔热的电气电子部件的方法SOLUTION：散热环氧树脂组合物包含（a）环氧树脂，（b）酸酐，（c）Al 2 O 3 （氧化铝） ），（d）球形微小填料和（e）作为润湿分散剂的硅烷化合物。;版权所有：（C）2004，JPO
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