首页> 外国专利> CAPPING MELT THIN FILM FORMATION METHOD AND METHOD FOR FORMING MGB2 SUPERCONDUCTING THIN FILM USING THE METHOD

CAPPING MELT THIN FILM FORMATION METHOD AND METHOD FOR FORMING MGB2 SUPERCONDUCTING THIN FILM USING THE METHOD

机译:覆盖熔融薄膜形成方法及使用该方法形成MGB2超导薄膜的方法

摘要

PPROBLEM TO BE SOLVED: To provide a method capable of forming a thin film consisting of a compound of a plurality of materials greatly varying in melting points and consequently greatly varying in vapor pressures by a vacuum vapor deposition method and of obtaining a compound thin film having sufficient characteristics by performing a heat treatment within the same vacuum condition and to provide a method for forming an MbBSB2/SBsuperconducting thin film by using the above method. PSOLUTION: The film 12 of the material having the low melting point is coated with the film 13 of the material having the high melting point, and thereafter temperature is increased and both the materials are reacted by a solid phase diffusion reaction or melt reaction to form the compound thin film 14. The material 12 having the high melting point is obstructed from being diffused to the outside of the film and is detained within the film by the film 13 of the material having the high melting point in spite of the temperature increase and therefore the thin film 14 consisting of the compound of both the materials can be formed. Also, the contamination of the apparatus does not occur and therefore the thin film of the other material can be formed in the same vacuum and a high compound function device can be formed. The in-situ formation of the MbBSB2/SBsuperconducting thin film is enabled by using the method. PCOPYRIGHT: (C)2004,JPO
机译:

要解决的问题:提供一种方法,该方法能够形成由多种材料的化合物组成的薄膜,该化合物的熔点通过真空气相沉积法而在蒸气压中变化很大,并且因此在蒸气压方面变化很大,并且能够获得化合物通过在相同的真空条件下进行热处理而具有足够特性的薄膜,并提供一种通过使用上述方法形成MbB 2 超导薄膜的方法。

解决方案:将具有低熔点的材料的膜12涂覆有具有高熔点的材料的膜13,然后升高温度,并且两种材料通过固相扩散反应或熔融而反应。通过反应形成化合物薄膜14,尽管具有高熔点的材料12被阻止,但具有高熔点的材料12扩散到膜的外部并且被具有高熔点的材料的膜13保留在膜内。温度升高,因此可以形成由两种材料的化合物组成的薄膜14。而且,不会发生设备的污染,因此可以在相同的真空中形成其他材料的薄膜,并且可以形成高复合功能的器件。利用该方法可以原位形成MbB 2 超导薄膜。

版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004143553A

    专利类型

  • 公开/公告日2004-05-20

    原文格式PDF

  • 申请/专利权人 JAPAN SCIENCE & TECHNOLOGY CORP;

    申请/专利号JP20020311510

  • 发明设计人 UCHIYAMA TETSUJI;

    申请日2002-10-25

  • 分类号C23C14/24;C01B35/04;C01G1/00;C23C14/28;C23C14/58;H01B12/06;H01B13/00;H01L39/24;

  • 国家 JP

  • 入库时间 2022-08-21 23:34:34

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