ULTRATHIN COPPER FOIL WITH CARRIER AND METHOD FOR MANUFACTURING THE SAME, AND PRINTED WIRING BOARD USING ULTRATHIN COPPER FOIL WITH CARRIER

摘要

PROBLEM TO BE SOLVED: To provide ultrathin copper foil with a carrier which permits easy peeling of carrier foil and ultarthin copper foil by having a release layer capable of withstanding a working temperature under a high temperature of in using a base material being a high-heat resistant resin and is provided with decreased pinholes by applying uniform plating to the foil without impairing the peelability of the release layer.;SOLUTION: The ultrathin copper foil with the carrier consists of the carrier foil, the release layer and the ultrathin copper foil and is formed by disposing a strike plating layer consisting of copper containing P on the surface of the release layer side between the release layer and the ultrathin copper foil, disposing the ultrathin layer of copper at need thereon and further disposing the ultarthin copper foil consisting of Cu or a copper alloy, or Cu containing P or a P-containing Cu alloy thereon. The release layer between the carrier foil and the ultrathin copper foil is preferably a hydration oxide layer containing Cr, Cr alloy or/and a hydration oxide layer containing Cr, Ni, Fe or their alloy layer or/and their hydration oxide layer.;COPYRIGHT: (C)2004,JPO