首页> 外国专利> METHOD FOR MANUFACTURING RESISTANCE VARYING ELEMENT, METHOD FOR MANUFACTURING NONVOLATILE RESISTANCE VARYING MEMORY DEVICE, AND NONVOLATILE RESISTANCE VARYING MEMORY DEVICE

METHOD FOR MANUFACTURING RESISTANCE VARYING ELEMENT, METHOD FOR MANUFACTURING NONVOLATILE RESISTANCE VARYING MEMORY DEVICE, AND NONVOLATILE RESISTANCE VARYING MEMORY DEVICE

机译:制造电阻变化元件的方法,制造非易失性变化存储器的方法以及非易失性变化的存储器

摘要

PROBLEM TO BE SOLVED: To enhance the circuit yield of a nonvolatile resistance varying memory device, and to enhance memory performance.;SOLUTION: The method for manufacturing a resistance varying element comprises a step for preparing a silicon substrate, a step for forming a silicon oxide layer on the substrate, a step for forming a first metal layer of a metal selected from a group of platinum and iridium on the silicon oxide layer, a step for forming a thin perovskite metal oxide film on the first metal layer, a step for depositing a second metal layer of a metal selected from a group of platinum and iridium on the thin perovskite metal oxide film, a step for annealing a multilayer structure obtained by the step for depositing the second metal layer at a temperature of 400-700°C for 5 min. to 3 hours, and a step for varying resistance between the first metal layer and the second metal layer.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:为了提高非易失性电阻变化型存储器件的电路成品率并增强存储性能。解决方案:电阻变化型元件的制造方法包括制备硅衬底的步骤,形成硅的步骤。在基板上形成一层氧化钙层,在氧化硅层上形成选自铂和铱中的一种金属的第一金属层的步骤,在第一金属层上形成钙钛矿薄金属氧化物膜的步骤,在钙钛矿金属氧化物薄膜上沉积选自铂和铱的金属的第二金属层,该步骤是对通过在400-700℃的温度下沉积第二金属层的步骤获得的多层结构进行退火的步骤5分钟至3小时,以及在第一金属层和第二金属层之间改变电阻的步骤。;版权所有:(C)2004,JPO&NCIPI

著录项

  • 公开/公告号JP2004241396A

    专利类型

  • 公开/公告日2004-08-26

    原文格式PDF

  • 申请/专利权人 SHARP CORP;

    申请/专利号JP20020381979

  • 发明设计人 SHIEN TEN SUU;ZHUANG WEI-WEI;

    申请日2002-12-27

  • 分类号H01L45/00;H01L27/10;

  • 国家 JP

  • 入库时间 2022-08-21 23:33:06

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