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COATING THICKNESS METER AND COATING THICKNESS MEASUREMENT METHOD

机译:镀层厚度计及镀层厚度测定方法

摘要

PROBLEM TO BE SOLVED: To provide a coating thickness meter and a coating thickness measurement method for precisely controlling coating thickness by improving the S/N ratio of an electric signal determined by measuring the coating thickness of a thin film during film formation without depending on a measurement wavelength.;SOLUTION: The coating thickness meter A comprises a light source 10 for projecting light to a substrate, where an optical thin film is formed; a spectroscope 20, where measurement light is guided from the substrate; and a controller 30. The spectroscope 20 comprises a spectral section 21 for dispensing measurement light, and a light reception section 28 having a plurality of photodiodes for photoelectrically converting the luminous flux being dispensed by the spectral section 21 for inducing a light reception current. The controller 30 comprises an exposure time pattern, where exposure time is set for each photodiode, and a means for transmitting a control signal for measuring light reception current output according to the spectroscope 20 according to the exposure time pattern.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:提供一种涂层厚度计和涂层厚度测量方法,其通过提高电信号的信噪比来精确地控制涂层厚度,所述电信号的信噪比通过在成膜期间测量薄膜的涂层厚度而确定,而无需依赖于解决方案:涂层厚度计A包括光源10,用于将光投射到形成光学薄膜的基板上。分光镜20,其中从基板引导测量光;光谱仪20包括:光谱部分21,用于分配测量光;以及光接收部分28,其具有多个光电二极管,用于光电转换由光谱部分21分配的光束,以感应光接收电流。控制器30包括:曝光时间模式,其中为每个光电二极管设置曝光时间;以及用于传输控制信号的装置,该控制信号用于测量根据光谱仪20根据曝光时间模式输出的光接收电流。 2004,日本特许厅

著录项

  • 公开/公告号JP2004212098A

    专利类型

  • 公开/公告日2004-07-29

    原文格式PDF

  • 申请/专利权人 SHINCRON:KK;

    申请/专利号JP20020379291

  • 发明设计人 SAI KYOKUYO;HIUGA YOHEI;

    申请日2002-12-27

  • 分类号G01B11/06;

  • 国家 JP

  • 入库时间 2022-08-21 23:31:11

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