SEMICONDUCTOR WAFER TO WHICH NEIGHBORING PASSIVE ELEMENT CHIP IS ELECTRICALLY CONNECTED, PASSIVE ELEMENT AND SEMICONDUCTOR PACKAGE USING SAME

摘要

PPROBLEM TO BE SOLVED: To make it possible to manufacture passive elements having various capacitances at low cost. PSOLUTION: A semiconductor wafer according to the present invention includes a number of passive elements separated by a plurality of scribe lines. The scribe line includes an electrical connection part between neighboring element units. Each passive element unit includes at least a pair of electrodes having opposite polarities. The scribe line extends in a first and second directions with respect to the wafer. When two passive element units are adjacent to each other in the first direction, the scribe line electrically connects an electrode having the same polarity between the passive element units, thereby the passive element units are connected in parallel. When two passive element units are adjacent to each other in the second direction, the scribe line electrically connects an electrode having the opposite polarity between the passive element units, thereby the passive element units are connected in series. PCOPYRIGHT: (C)2004,JPO