首页> 外国专利> PHASE SHIFT MASK, METHOD FOR FORMING PATTERN BY USING PHASE SHIFT MASK, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

PHASE SHIFT MASK, METHOD FOR FORMING PATTERN BY USING PHASE SHIFT MASK, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

机译:移相掩模,利用移相掩模形成图案的方法以及制造电子设备的方法

摘要

PROBLEM TO BE SOLVED: To provide a phase shift mask for forming a pattern having excellent dimensional uniformity at a low cost without decreasing the integration degree, and to provide a method for forming a pattern by using the above phase shift mask and a method for manufacturing an electronic device.;SOLUTION: The phase shift mask has a halftone light shielding film 2 formed on a substrate 1 and having an opening 2a to expose a part of the surface of the substrate 1. The phase of the exposure light passing through the halftone light shielding film 2 differs by 180° from the phase of the exposure light passing through the opening 2a. The transmission rate defined as the ratio of the intensity of the exposure light passing through the halftone light shielding film 2 to the intensity of the exposure light passing through the opening 2a is ≥15% and ≤25%. The dimension of the opening 2a is ≥0.26 and ≤0.45 on the basis of (wavelength λ of the exposure light)/(numerical aperture NA)=1.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:提供一种用于在不降低集成度的情况下低成本地形成具有优异的尺寸均匀性的图案的相移掩模,并且提供一种通过使用上述相移掩模来形成图案的方法以及一种制造方法解决方案:相移掩模具有形成在基板1上的半色调遮光膜2,该半色调遮光膜2具有用于暴露基板1的一部分表面的开口2a。遮光膜2相差180°。从穿过开口2a的曝光光的相位开始。透射率定义为穿过半色调遮光膜2的曝光光的强度与穿过开口2a的曝光光的强度之比为±15%和±25%。基于(曝光光的波长λ)/(数值孔径NA)= 1,开口2a的尺寸为±0.26和±0.45。版权所有:(C)2004,JPO&NCIPI

著录项

  • 公开/公告号JP2004251969A

    专利类型

  • 公开/公告日2004-09-09

    原文格式PDF

  • 申请/专利权人 RENESAS TECHNOLOGY CORP;

    申请/专利号JP20030039582

  • 发明设计人 NAKAO SHUJI;

    申请日2003-02-18

  • 分类号G03F1/08;G03F7/20;H01L21/027;

  • 国家 JP

  • 入库时间 2022-08-21 23:29:52

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号