Method for producing electrical and / or mechanical connections between flexible thin film substrates and contact arrangement between flexible thin film substrates

摘要

The method involves positioning the substrates (1), each of which has an opening at a joining point, so that their openings coincide, positioning a bonding element (7) on both sides of the aligned openings, pressing the bonding elements, which at least partly enclose the facing peripheral edges of the openings, together to form a bonded joint. Independent claims are also included for the following: a contact arrangement.