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The low temperature calcination porcelain constituent and the low temperature calcination porcelain and the wiring substrate null which uses
The low temperature calcination porcelain constituent and the low temperature calcination porcelain and the wiring substrate null which uses
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机译:所使用的低温煅烧瓷料成分和低温煅烧瓷料及布线基板
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摘要
PROBLEM TO BE SOLVED: To provide a low-temperature firing ceramics composition suitable for an insulation board of a wiring board whose thermal expansion coefficient is high, dielectric loss is low and decrease in strength after heat cycle is little, the low-temperature fired ceramics and the wiring board using the above ceramics.;SOLUTION: The low-temperature firing ceramics composition contains Si, Ba, B, Al and Zr whose contents are 55-70 wt.% expressed in terms of SiO2, 20-40 wt.% expressed in terms of BaO, 1-8 wt.% expressed in terms of Al2O3 and 0 wt.% and ≤7 wt.% expressed in terms of ZrO2, respectively. The above composition which contains a quarts crystal of ≥30 wt.% is used as the insulation board 1 of the wiring board A.;COPYRIGHT: (C)2002,JPO
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机译:解决的问题:为了提供适用于热膨胀系数高,介电损耗低且热循环后强度降低少的布线板的绝缘板的低温烧制陶瓷组合物,该低温烧制陶瓷SOLUTION:低温烧结陶瓷组合物包含Si,Ba,B,Al和Zr,其含量为SiO2的55-70 wt%,20-40 wt。%以BaO计,以Al 2 O 3表示的含量为1-8wt%,以ZrO 2表示的> 0wt。%和≤7wt%。包含≥30wt。%的石英晶体的上述组合物用作布线板A的绝缘板1。COPYRIGHT:(C)2002,JPO
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