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Based pad layout for reducing parasitic base-collector capacitance and method of fabricating HBT using the same
Based pad layout for reducing parasitic base-collector capacitance and method of fabricating HBT using the same
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机译:用于减小寄生基极-集电极电容的基于焊盘的布局及其制造方法
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摘要
The present invention relates to a base pad layout for reducing the parasitic base-collector capacitance and method of fabricating HBT using the same. ;The present invention comprises a base region which is aligned in a 011 or 011 orientation with respect to the semiconductor substrate; a base pad region which has a fixed slope with respect to said base region; and a base feeding region which is aligned in a 010 orientation and connects said base region and said base pad region. ;According to the present invention, the base-collector capacitance due to base pad could be reduced through a simple base pad layout and wet etching which isolates an active base region and a base pad region. ;The present invention uses the conventional wet etching method for fabricating a triple mesa HBT involving only a modification of the base pad layout, hence, no additional process is required.
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