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Methods of forming conductive capacitor plugs, methods of forming capacitor contact openings, and methods of forming memory arrays

机译:形成导电电容器插头的方法,形成电容器触点开口的方法以及形成存储器阵列的方法

摘要

Methods of forming conductive capacitor plugs, methods of forming capacitor contact openings, and methods of forming memory arrays are described. In one embodiment, a conductive capacitor plug is formed to extend from proximate a substrate node location to a location elevationally above all conductive material of an adjacent bit line. In another embodiment, a capacitor contact opening is etched through a first insulative material received over a bit line and a word line substantially selective relative to a second insulative material covering portions of the bit line and the word line. The opening is etched to a substrate location proximate the word line in a self-aligning manner relative to both the bit line and the word line. In another embodiment, capacitor contact openings are formed to elevationally below the bit lines after the bit lines are formed. In a preferred embodiment, capacitor-over-bit line memory arrays are formed.
机译:描述了形成导电电容器插头的方法,形成电容器触点开口的方法以及形成存储器阵列的方法。在一实施例中,导电电容器塞形成为从邻近衬底节点位置延伸到在相邻位线的所有导电材料之上的高度位置。在另一实施例中,通过相对于覆盖位线和字线的部分的第二绝缘材料基本上选择性的,通过在位线和字线上接收的第一绝缘材料蚀刻电容器触点开口。相对于位线和字线以自对准的方式将开口蚀刻到字线附近的衬底位置。在另一实施例中,在形成位线之后,将电容器接触开口形成为在位线下方垂直。在优选的实施例中,形成了位电容器线路存储阵列。

著录项

  • 公开/公告号US2004097085A1

    专利类型

  • 公开/公告日2004-05-20

    原文格式PDF

  • 申请/专利权人 TRAN LUAN C.;

    申请/专利号US20030612839

  • 发明设计人 LUAN C. TRAN;

    申请日2003-07-03

  • 分类号H01L21/302;H01L21/461;

  • 国家 US

  • 入库时间 2022-08-21 23:20:53

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