A wafer dryer system which is suitable for drying rinse water from substrates in the event of a system malfunction or failure during or after rinsing of the substrates. The wafer dryer system typically includes a pair of drying chambers, each of which is fitted with at least one nitrogen gas inlet, at least one IPA gas inlet and an exhaust opening. A wafer boat which holds multiple wet wafers from an interrupted rinsing process typically in a wet bench system is placed in one of the chambers, after which the chamber is filled with hot nitrogen gas and mixed IPA gas to dry the wafers in the wafer boat. Upon resumption of operation of the wet bench system from which the wafers were taken or upon availability of a second wet bench system, the dried wafers are removed from the chamber for continued rinsing, as necessary.
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