Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials

摘要

The invention relates to a process permitting defects or stresses in a structure to be revealed, comprising the following steps: ;securing by molecular bonding of a face of a first element containing crystalline material with a face of a second element containing crystalline material, so that said faces have offset crystalline lattices, the securing causing the formation of a lattice of crystalline defects and/or stress fields in a crystalline zone next to the securing interface; ;reduction of the thickness of one of the elements until at least a thin film is obtained which adheres to the other element, along the securing interface to form said structure, the thickness of the thin film being such that its free face does not reveal the crystalline defect lattice and/or the stress fields, the thickness of the thin film also being such that the following step is possible; ;treatment of the thin film resulting in that its free face reveals the crystalline defect lattice and/or the stress fields.