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Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same
Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same
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机译:半导体用粘接膜,具有半导体用粘接膜的引线框架及使用该引线框架的半导体装置
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摘要
An adhesive film for semiconductor, which has a three-layer structure consisting of a support film having each face coated with an adhesive layer, each adhesive layer containing (A) a heat resistant thermoplastic resin having a glass transition temperature of 130 to 300 C., a water absorption of 3% by weight or less and a squeeze length of 2 mm or less, (B) an epoxy resin and (C) a trisphenol compound as an epoxy resin-curing agent; a lead frame with adhesive film; and a semiconductor device wherein the lead frame with adhesive film is bonded to a semiconductor element.
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