Method of providing HBM protection with a decoupled HBM structure

摘要

A semiconductor device that includes an integrated circuit and an HBM structure formed on different semiconductor substrates is provided. The HBM structure may include input or output or input/output circuitry coupled to the integrated circuit and protection structures coupled to the input or output or input/output circuitry. In an embodiment, the integrated circuit may include input or output or input/output structures spaced across an area of the integrated circuit. The input or output or input/output circuitry of the HBM structure may be coupled to the input or output or input/output structures of the integrated circuit. A method for developing a design for an HBM structure is also provided. The method may include coupling an HBM structure formed on a first semiconductor substrate to an integrated circuit formed on a second semiconductor substrate. The method may also include testing the HBM structure and altering the HBM design based on the testing.