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Porous CPU cooler

机译:多孔CPU散热器

摘要

The invention is to provide a porous CPU cooler, which comprises a heat sink having a plurality of pores formed therein and therearound being in fluid communication with one another, and at least one heat-directing member on the heat sink. In operation, a current of air is either directed into the pores of the heat sink through the heat-directing member prior to leaving the pores on the surface of the heat sink or directed into the pores of the heat sink from the surface of the heat sink prior to leaving the heat-directing member. Either air path can carry heat accumulated inside and on the surface of the heat sink away for achieving the purpose of cooling CPU.
机译:本发明提供了一种多孔CPU冷却器,该多孔CPU冷却器包括:散热器,在散热器中形成有多个孔,这些孔彼此之间流体连通;以及散热器上的至少一个热引导构件。在操作中,空气流或者通过热引导构件被引导到散热器的孔中,然后将孔留在散热器的表面上,或者从热量的表面被引导到散热器的孔中。在离开传热部件之前先下沉。任何一条风路都可以将积聚在散热器内部和表面的热量带走,以达到冷却CPU的目的。

著录项

  • 公开/公告号US6735083B2

    专利类型

  • 公开/公告日2004-05-11

    原文格式PDF

  • 申请/专利权人 INVENTEC CORPORATION;

    申请/专利号US20020212696

  • 发明设计人 SHU-JU LIN;

    申请日2002-08-07

  • 分类号H05K72/00;

  • 国家 US

  • 入库时间 2022-08-21 23:17:32

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