Assembly of power circuits and numerical data printed on a multilayer board

摘要

A multilayer circuit assembly includes a power circuit and a numerical data circuit. The power circuit includes a power layer and power components. The numerical data circuit includes a numerical data layer and numerical data components. Power components and numerical data components are incorporated on an external surface of the numerical data layer. Preferably, all of the power components are incorporated on an external face of a numerical data layer. The numerical data layer may be a different thickness than the power circuit layer, and is generally thinner. The assembly may also include an insulating substrate disposed between the power circuit layer and the numerical data layer. The numerical data layer and the power circuit layer may be etched on opposite sides of the insulating substrate. The assembly can also include additional numerical and/or power circuit layers. The power components are typically connected to the power layer using blind vias.