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Reduced integrated circuit chip leakage and method of reducing leakage

机译:减少集成电路芯片泄漏和减少泄漏的方法

摘要

An integrated circuit that may include an array such as a static random access memory (SRAM) with high threshold device array devices and in selected other devices to reduce leakage. Devices with high threshold have a thicker gate oxide or a high k dielectric gate oxide that is selected based on threshold voltage (VT) variations with gate oxide dielectric type or gate oxide thickness for the particular technology, e.g., PD SOI CMOS. High threshold devices may be used in non-core circuits, e.g., test circuits. Also, non-critical paths may be identified and a non-critical path margin identified. A thicker device threshold is selected for non-critcal path FETs based on the non-critical path margin. Non-critical path delays are re-checked. FETs are formed with the selected thicker gate oxide for any non-critical paths passing the re-check and in array FETs with non-selected FETs being formed with normal gate oxide thickness.
机译:一种集成电路,可以包括诸如具有高阈值设备阵列设备的静态随机存取存储器(SRAM)之类的阵列,并且可以包括在选定的其他设备中以减少泄漏。具有高阈值的器件具有较厚的栅极氧化物或高k介电栅极氧化物,这是根据特定技术的阈值电压(V T )随栅极氧化物电介质类型或栅极氧化物厚度的变化而选择的,PD SOI CMOS。高阈值器件可以用在非核心电路,例如测试电路中。而且,可以识别非关键路径并且识别非关键路径裕度。基于非关键路径裕量为非关键路径FET选择较厚的设备阈值。重新检查非关键路径延迟。对于通过重新检查的任何非关键路径,用选定的较厚栅极氧化物形成FET,并在阵列FET中形成具有正常栅极氧化物厚度的未选定FET。

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