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Hardener for an epoxy resin compound, method for curing an epoxy resin compound, epoxy resin compound, and utilizations thereof

机译:环氧树脂化合物的固化剂,环氧树脂化合物的固化方法,环氧树脂化合物及其用途

摘要

A hardener for an epoxy resin includes an accelerator having a tetraalkylphosphonium salt. The tetraalkylphosphonium salt has the following formula: ;R′, R″, R′″, R″″ are individually-selected alkyls ranging from C2 to C20, ;X− is an anion such as Hal−, ClO4−, RCO2(Ac−), MX′6−; where M is P, As, Sb; and X− is Hal−. ;The hardener, an application thereof in the fabrication of an epoxy resin, the epoxy resin itself, and a method for curing an epoxy resin compound, create a material system that is suitable for the field of optoelectronics.
机译:环氧树脂用固化剂包括具有四烷基phosph盐的促进剂。四烷基phosph盐具有下式:; R&prime ;, R&Prime ;, R&prime;&Prime ;, R&Prime;&Prime;是从C 2 到C 20 的单个选择的烷基,; X &minus; 是阴离子,例如Hal &minus; < / Sup>,ClO 4 &minus; ,RCO 2 (Ac &minus; ),MX&prime; 6 &minus; ;其中M是P,As,Sb; X &minus; 是Hal &minus; 。硬化剂,其在环氧树脂制造中的应用,环氧树脂本身以及用于固化环氧树脂化合物的方法,创造了一种适合光电子领域的材料体系。

著录项

  • 公开/公告号US2003214073A1

    专利类型

  • 公开/公告日2003-11-20

    原文格式PDF

  • 申请/专利权人 HOHN KLAUS;HEKELE WILHELM;

    申请/专利号US20030426821

  • 发明设计人 KLAUS HOHN;WILHELM HEKELE;

    申请日2003-04-30

  • 分类号C08G59/42;C08L63/00;

  • 国家 US

  • 入库时间 2022-08-21 23:16:12

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