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METHOD OF CHARGING HOLE WITH FLUID MATERIAL.

机译:用流体材料给孔充电的方法。

摘要

A method of charging a hole (24) in a substrate (23) with fluid material (50) comprises the steps of supplying the fluid material (50) onto a surface of the substrate (23); and forcing the fluid material (50) into the hole (24) along at least three different directions on the surface of the substrate (23) to charge the hole (24) with the fluid material (50). The forcing step may comprise using a forcing means (9) placed on the surface of the substrate (23) in forcing the fluid material (50) into the hole (24); and rotating the forcing means (9) about an axis perpendicular to the surface of the substrate (23) and moving the axis of rotation of the forcing member (9) along the surface of the substrate (23) to force the fluid material (50) into the hole (24) along the at least three different directions.
机译:一种用流体材料(50)填充衬底(23)中的孔(24)的方法,包括将流体材料(50)供应到衬底(23)的表面上的步骤;沿所述基板(23)的表面上的至少三个不同方向迫使所述流体材料(50)进入所述孔(24),以向所述孔(24)填充所述流体材料(50)。强制步骤可包括在将流体材料(50)压入孔(24)中时,使用置于基板(23)表面上的压紧装置(9);或将压紧装置(9)压紧。使施力装置(9)绕垂直于基板(23)的表面的轴线旋转,并使施力构件(9)的旋转轴线沿基板(23)的表面移动,以使流体材料(50)受力。 )沿至少三个不同方向进入孔(24)。

著录项

  • 公开/公告号MXPA02007345A

    专利类型

  • 公开/公告日2004-08-11

    原文格式PDF

  • 申请/专利权人 DENSO CORPORATION;

    申请/专利号MX2002PA07345

  • 发明设计人 KITAMURA;NOBUYUKI;

    申请日2002-07-29

  • 分类号B66F9/00;

  • 国家 MX

  • 入库时间 2022-08-21 23:10:08

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