首页> 外国专利> A method for reducing effect of a narrow channel in a transistor in a semiconductor device with a trench isolation, and such a semiconductor device.

A method for reducing effect of a narrow channel in a transistor in a semiconductor device with a trench isolation, and such a semiconductor device.

机译:一种用于减小具有沟槽隔离的半导体器件中的晶体管中的窄沟道的影响的方法,以及这种半导体器件。

摘要

Narrow-channel effect free DRAM cell transistor structure for submicron isolation pitch DRAMs having lowed-doped substrate and active width-independent threshold voltage by employing conductive shield in the shallow trench isolation(STI). The resulting cell transistor structure is highly immune to parasitic E-field penetration from the gate and neighbouring storage node junctions via STI and will be very appropriate for Gbit scale DRAM technology. The conductive shield is biased with the negative voltage in order to minimize the sidewall depletion in the substrate.
机译:通过在浅沟槽隔离(STI)中采用导电屏蔽,可实现具有低掺杂衬底和有源宽度无关阈值电压的亚微米隔离节距DRAM的无窄通道效应DRAM单元晶体管结构。所得的单元晶体管结构对通过STI从栅极和相邻存储节点的结点产生的寄生电场的渗透具有很高的免疫力,非常适合于千兆位DRAM技术。导电屏蔽层用负电压偏置,以最大程度地减少基板中的侧壁损耗。

著录项

  • 公开/公告号NL1018769C2

    专利类型

  • 公开/公告日2004-09-16

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号NL20011018769

  • 发明设计人 KI-NAM KIM;JAI-HOON SIM;JAE-GYU LEE;

    申请日2001-08-16

  • 分类号H01L21/765;H01L29/772;H01L21/8242;H01L21/762;H01L27/108;

  • 国家 NL

  • 入库时间 2022-08-21 23:09:46

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