Low dielectric constant films derived by sol-gel processing of a hyperbranched polycarbosilane

摘要

A hybrid organic/inorganic organosilicon networked polymer material having a compositional formula [Si(O)CH2]n and a dielectric constant of less than 2.4 is provided. The material may be used as an interlayer dielectric film in a semiconductor device. The film is preferably fabricated by a sol-gel process using an alkoxy substituted hyperbranched polycarbosilane precursor material.