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Method of fabricating double photoresist layer self-aligned heterojunction bipolar transistor

机译:双光阻层自对准异质结双极晶体管的制造方法

摘要

A heterejunction bipolar transistor and a method for fabricating an HBT with self-aligned base metal contacts using a double photoresist, which requires fewer process steps than known methods, while minimizing damage to the active emitter contact region. In particular, a photoresist is used to form the emitter mesa. The emitter mesa photoresist is left on and a double polymethylmethacrylate (PMMA) and photoresist layer is then applied. The triple photoresist combination is patterned to create a non- critical lateral alignment for the base metal contacts to the emitter mesa, which permits selective base ohmic metal deposition and lift-off. By utilizing the double photoresist as opposed to a metal or dielectric for masking, an additional photolithography step and etching step is eliminated. By eliminating the need for an additional etching step, active regions of the semiconductors are prevented from being exposed to the etching step and possibly damaged.
机译:一种异质结双极晶体管和使用双光致抗蚀剂制造具有自对准贱金属触点的HBT的方法,与已知方法相比,该方法所需的工艺步骤更少,同时将对有源发射极触点区域的损害降至最低。特别地,光致抗蚀剂用于形成发射极台面。保留发射极台面光刻胶,然后涂覆双聚甲基丙烯酸甲酯(PMMA)和光刻胶层。对三层光致抗蚀剂组合进行构图,以使基础金属与发射极台面的接触形成非关键性的横向排列,从而允许选择性地沉积基础欧姆金属并进行剥离。通过利用与金属或电介质相对的双重光致抗蚀剂进行掩模,可以省去额外的光刻步骤和蚀刻步骤。通过消除对额外的蚀刻步骤的需要,防止了半导体的有源区暴露于蚀刻步骤并且可能损坏半导体。

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