ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE

摘要

The present invention relates to an integrated circuit package having a thermally conductive element (122) thermally coupled to a semiconductor die (130) and a heat sink (110/112), and a method of manufacturing said integrated circuit package. The thermally conductive element (122) is integrated into the package to enhance thermal dissipation characteristics of the package.