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METHOD AND APPARATUS FOR MICRO-JET ENABLED, LOW ENERGY ION GENERATION AND TRANSPORT IN PLASMA PROCESSING

机译:等离子体处理中实现微射流,低能离子产生和传输的方法和装置

摘要

A method for creating and transporting low-energy ions for use in plasma processing of a semiconductor wafer is disclosed. In an exemplary embodiment of the invention, the method includes generating plasma from a gas species to produce a plasma exhaust. The plasma exhaust is then introduced into a processing chamber containing the wafer. The ion content of the plasma exhaust is enhanced by activating a supplemental ion source as the plasma is introduced into the processing chamber, thereby creating a primary plasma discharge therein. Then, the primary plasma discharge is directed into a baffle plate assembly, thereby creating a secondary plasma discharge exiting the baffle plate assembly. The strength of an electric field exerted on ions contained in the secondary plasma discharge is reduced. In so doing, the reduced strength of the electric field causes the ions to bombard the wafer at an energy insufficient to cause damage to semiconductor devices formed on the wafer.
机译:公开了一种用于产生和传输用于半导体晶片的等离子体处理中的低能离子的方法。在本发明的示例性实施例中,该方法包括从气体物种产生等离子体以产生等离子体排气。然后将等离子废气引入包含晶片的处理室中。当将等离子体引入处理室时,通过激活补充离子源来增加等离子体排气的离子含量,从而在其中产生初级等离子体放电。然后,将主要的等离子体放电引入挡板组件,从而产生离开挡板组件的次级等离子体放电。施加在二次等离子体放电中包含的离子上的电场强度降低。这样,电场强度的降低导致离子以不足以对形成在晶片上的半导体器件造成损坏的能量轰击晶片。

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