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High voltage semiconductor device having deep trench terminations and method for fabricating the same

机译:具有深沟槽终端的高压半导体器件及其制造方法

摘要

PURPOSE: A high voltage semiconductor device with a deep trench termination is provided to improve breakdown voltage by forming a trench that passes through a p typed base region and an n¬- typed collector region and reaches a predetermined depth of an n¬+ typed collector region. CONSTITUTION: A high density collector region(200) of the first conductivity type, a low density collector region(210) of the first conductivity type and a low density base region(220) of the second conductivity type are sequentially formed on a high voltage semiconductor substrate. A trench(260) that passes through the base region and the low density collector region and reaches a predetermined depth of the high density collector region is included, located in the outermost portion of the device including a scribe line.
机译:目的:提供具有深沟槽终端的高压半导体器件,以通过形成穿过p型基极区和n-型集电极区并到达n +型集电极区的预定深度的沟槽来提高击穿电压。 。组成:在高压下依次形成第一导电类型的高密度集电极区(200),第一导电类型的低密度集电极区(210)和第二导电类型的低密度基极区(220)半导体衬底。包括穿过基底区域和低密度集电极区域并到达高密度集电极区域的预定深度的沟槽(260),其位于包括划线的器件的最外部。

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