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Vacuum sealing system between gas injection ring and chamber wall in semiconductor manufacturing equipment

机译:半导体制造设备中注气环与腔室壁之间的真空密封系统

摘要

PURPOSE: A vacuum sealing system in semiconductor manufacturing equipment is provided to be capable of securing the vacuum sealing between a chamber wall and a gas injection ring. CONSTITUTION: A vacuum sealing system in semiconductor manufacturing equipment is provided with a chamber wall(100) having a groove, an O-ring(400) inserted into the groove, and a gas injection ring(200) for facing the chamber wall. At this time, the O-ring is between the chamber wall and the gas injection ring. Preferably, the chamber wall is bottom portion and the gas injection ring is loaded on the chamber wall.
机译:目的:提供一种半导体制造设备中的真空密封系统,该系统能够确保腔室壁和气体注入环之间的真空密封。构成:一种半导体制造设备中的真空密封系统,其具有一个带有凹槽的腔室壁(100),插入该凹槽中的O形圈(400)和一个面向腔室壁的气体注入环(200)。此时,O形圈位于腔室壁和气体注入环之间。优选地,腔室壁是底部,并且气体注入环被加载在腔室壁上。

著录项

  • 公开/公告号KR20040019197A

    专利类型

  • 公开/公告日2004-03-05

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20020050538

  • 发明设计人 KIM BYEONG SU;

    申请日2002-08-26

  • 分类号H01L21/02;

  • 国家 KR

  • 入库时间 2022-08-21 22:49:38

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