METHOD FOR INSTALLING ELECTRIC COMPONENT ONTO WIRING SUBSTRATE, CONCERNED WITH FORMING SIMULTANEOUSLY SOLDERING COMPONENT AS WELL AS THIN SOLDERING LAYER ON FLIP CHIP CONNECTING PAD

摘要

PURPOSE: A method for installing an electric component onto a wiring substrate is provided to simplify a fabrication process by forming simultaneously a soldering component as well as a thin soldering layer on a flip chip connecting pad. CONSTITUTION: An adhesive resin layer(18) is formed on a connecting pad(14) and a mounting pad(16). Solder particles are temporarily adhered to the connecting pad and the mounting pad by scattering the solder particles. A soldering component(22) is mounted on the mounting pad. A thin soldering layer is pre-coated on the connecting pad by a reflow process for the solder particles. The soldering component is mounted on the mounting pad by performing a soldering process. A bare chip is installed on the thin soldering layer. The bare chip is connected to the connecting pad by a flip chip connection method.