Electronic component has connecting contact for electrical contacting and solder layer partly capped with another solder layer, where total solder quantity is multiple of solder quantity of former solder layer

摘要

The electronic component has a connecting contact (1) for electrical contacting with an electric conductor. The connecting contact has a substrate (2), which is provided with a solder layer (4). An intermetallic zone (5) is formed by the solder layer within the area of the transition of the substrate. Another solder layer is applied subsequently to the former solder layer, forming an additional soldering depot. The former solder layer is partly capped with the later solder layer. The total solder quantity is a multiple of the solder quantity of the former solder layer. An independent claim is also included for a method for manufacturing the electronic component.